DGAP-Media / 30.06.2016 / 10:00 SUSS MicroTec announces new Mask Aligner series MA/BA Gen4 Garching, June 30, 2016 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of the MA/BA Gen4 series today. The new generation of SUSS MicroTec's semi-automated Mask and Bond Aligners extends its capabilities by major improvements in alignment accuracy, ergonomic design and further reduced cost of ownership. With the launch of the fourth generation, SUSS MicroTec introduces a new platform system. The two platform types are configured differently and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series for advanced high-end processes. By moving to this new platform concept, SUSS MicroTec further optimizes the Mask Aligner product portfolio to better align with customer requirements. Main application of SUSS MicroTec's MA/BA Gen4 series is full-field lithography in Academia, MEMS, 3D Integration and the Compound Semiconductor market. It furthermore handles processes like bond alignment, fusion bonding and SMILE imprint. In addition to standard wafer processing the MA/BA Gen4 series reliably processes delicate substrates, such as fragile, warped or uneven surfaced wafers. "Our new manual Mask Aligner series sets a high benchmark regarding cost efficiency, user friendliness and leading edge process results" said Dr. Per-Ove Hansson, CEO SUSS MicroTec. "With this new platform concept, we further align with different customer requirements - the MA/BA Gen4 for standard lithography processes or the leading edge MA/BA Gen4 Pro for small-series production and more demanding solutions, e.g. our Soft Conformal Imprint Lithography (SCIL) solution." About SUSS MicroTec SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com Contact: SUSS MicroTec AG Franka Schielke Schleissheimer Strasse 90 85748 Garching, Deutschland Tel.: +49 (0)89 32007-161 Fax: +49 (0)89 32007-451 Email: [email protected] End of Media Release --------------------------------------------------------------------------- Issuer: SÜSS MicroTec AG Key word(s): Research/Technology 30.06.2016 Dissemination of a Press Release, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de --------------------------------------------------------------------------- Language: English Company: SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching Germany Phone: +49 (0)89 32007-161 Fax: +49 (0)89 32007-451 E-mail: [email protected] Internet: www.suss.com ISIN: DE000A1K0235 WKN: A1K023 Indices: TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Munich, Stuttgart End of News DGAP Media --------------------------------------------------------------------------- 475891 30.06.2016