18.05.2016 SÜSS MicroTec AG  DE000A1K0235

DGAP-News: SUSS MicroTec Launches LI Series - the New Operator-Assisted Surface Laser Imagers


 
DGAP-News: SÜSS MicroTec AG / Key word(s): Product Launch SUSS MicroTec Launches LI Series - the New Operator-Assisted Surface Laser Imagers 18.05.2016 / 14:00 The issuer is solely responsible for the content of this announcement. --------------------------------------------------------------------------- SUSS MicroTec Launches LI Series - the New Operator-Assisted Surface Laser Imagers Garching, May 19, 2016 - SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the LI Series - a new Surface Laser Imaging platform as pre- announced on May 4, 2016. The highly versatile technology of the LI for laser surface processing ranges from sub micrometric pattering of resist coated substrates to micro- ablation, photo-chemistry treatment as well as metrology. The patterns, defined by a CAD process, are transferred by accurately moving the targeted substrates underneath a focused and scanning laser beam. In addition, the Laser Imager configuration is highly customizable, to best fit the specific requirements of each user. The technology supports substrate sizes from small pieces up to 300 mm, and it reaches a resolution down to 0.8 µm. Multi-layer alignment is possible via both top and bottom side alignment optical systems. Beside the 405 nm GaN laser for standard thin resist lithography processes, a second laser source can also be added to additionally address diverse processes such as, among other, thick resists like SU8, and infrared sensitive materials. Core advantage of the Laser Imager is its flexibility, making it suitable for the various requirements of academic and industrial R&D facilities. The main applications include a wide variety of nano- and 3D structuring for high resolution wafer lithography, micro-optical components, sensors, microfluidic devices, and photo mask manufacturing. "With the Surface Laser Imaging platform, we add a tool to our product portfolio that expands our existing exposure equipment set towards higher resolution requirements for leading edge applications." says Dr. Per-Ove Hansson, CEO of SUSS MicroTec AG. "With this addition, we are enhancing our leadership position and offering the most comprehensive set of products and technologies for the lithography R&D market." About SUSS MicroTec SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com Contact: SUSS MicroTec AG Franka Schielke Schleissheimer Strasse 90 85748 Garching, Deutschland Tel.: +49 (0)89 32007-161 Fax: +49 (0)89 32007-451 Email: [email protected] --------------------------------------------------------------------------- 18.05.2016 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Media archive at www.dgap-medientreff.de and www.dgap.de --------------------------------------------------------------------------- Language: English Company: SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching Germany Phone: +49 (0)89 32007-161 Fax: +49 (0)89 32007-451 E-mail: [email protected] Internet: www.suss.com ISIN: DE000A1K0235 WKN: A1K023 Indices: TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Munich, Stuttgart End of News DGAP News Service --------------------------------------------------------------------------- 464625 18.05.2016


Die wichtigsten Finanzdaten auf einen Blick
  2017 2018 2019 2020 2021 2022 2023e
Umsatzerlöse1 166,52 203,93 213,80 252,11 263,44 299,14 304,26
EBITDA1,2 17,98 15,72 -5,19 28,20 29,60 41,90 34,65
EBITDA-Marge3 10,80 7,71 -2,43 11,19 11,24 14,01
EBIT1,4 13,90 10,87 -13,76 20,44 22,55 32,81 27,79
EBIT-Marge5 8,35 5,33 -6,44 8,11 8,56 10,97 9,13
Jahresüberschuss1 6,71 4,78 -16,26 12,36 16,02 24,52 4,70
Netto-Marge6 4,03 2,34 -7,61 4,90 6,08 8,20 1,55
Cashflow1,7 9,38 1,92 -30,80 55,16 24,33 23,94 3,79
Ergebnis je Aktie8 0,35 0,25 -0,85 0,65 0,84 1,28 0,25
Dividende8 0,00 0,00 0,00 0,00 0,16 0,20 0,00
Quelle: boersengefluester.de und Firmenangaben

  Geschäftsbericht 2023 - Kostenfrei herunterladen.  
1 in Mio. Euro; 2 EBITDA = Ergebnis vor Zinsen, Steuern und Abschreibungen; 3 EBITDA in Relation zum Umsatz; 4 EBIT = Ergebnis vor Zinsen und Steuern; 5 EBIT in Relation zum Umsatz; 6 Jahresüberschuss (-fehlbetrag) in Relation zum Umsatz; 7 Cashflow aus der gewöhnlichen Geschäftstätigkeit; 8 in Euro; Quelle: boersengefluester.de

Wirtschaftsprüfer: Baker Tilly

INVESTOR-INFORMATIONEN
©boersengefluester.de
Süss MicroTec
WKN Kurs in € Einschätzung Börsenwert in Mio. €
A1K023 40,700 Kaufen 778,00
KGV 2025e KGV 10Y-Ø BGFL-Ratio Shiller-KGV
26,26 26,36 0,99 62,23
KBV KCV KUV EV/EBITDA
4,50 205,44 2,56 21,63
Dividende '22 in € Dividende '23e in € Div.-Rendite '23e
in %
Hauptversammlung
0,20 0,20 0,49 11.06.2024
Q1-Zahlen Q2-Zahlen Q3-Zahlen Bilanz-PK
08.05.2024 07.08.2024 07.11.2024 27.03.2024
Abstand 60Tage-Linie Abstand 200Tage-Linie Performance YtD Performance 52 Wochen
11,61% 50,07% 46,93% 59,92%
    
Weitere Ad-hoc und Unternehmensrelevante Mitteilungen zu SÜSS MicroTec AG  ISIN: DE000A1K0235 können Sie bei EQS abrufen


Halbleiter , A1K023 , SMHN , XETR:SMHN