28.06.2018
Manz AG DE000A0JQ5U3
DGAP-News: Manz AG: Strategic cooperation in the microelectronics area opens up new prospects in this attractive, future-oriented field
DGAP-News: Manz AG / Key word(s): Alliance
Manz AG: Strategic cooperation in the microelectronics area opens up new
prospects in this attractive, future-oriented field
28.06.2018 / 07:29
The issuer is solely responsible for the content of this announcement.
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Manz AG: Strategic cooperation in the microelectronics area opens up new
prospects in this attractive, future-oriented field
- New trend in packaging of microchips: fan-out panel level packaging
realized using Manz wet-chemical production technology
- Strategic partnership ensures access to high-performing, future-oriented
technology
- First order received from cooperation partners with more than 5 million
EUR volume
Reutlingen, June 28, 2018 - Manz AG, a global high-tech equipment
manufacturer with a comprehensive technology portfolio, has started a
strategic cooperation in the area of Fan-Out Panel Level Packaging (FOPLP)
with one of the most influential microelectronics enterprises in China which
is engaged in investment, development and operations management of
microelectronics business , and PEP Innovation PTE Ltd, a technology company
headquartered in Singapore. The goal is to jointly develop and market this
high-performing and future-oriented technology used to package microchips.
As part of the cooperation, Manz AG has already received its first order
with more than 5 million EUR volume from a joint venture company founded by
the cooperation partners.
Microchips are based on silicon wafers, on which chip manufacturers transfer
the circuit layout using a photolithographic process. Chips are then
encapsulated with an epoxy compound after the production process to protect
them and facilitate contacting. This process is called packaging. Fan-out
panel level packaging, the newest packaging process, plays a key role as
electronic components increasingly become miniaturized even as they offer
better performance. In addition to significantly reducing the volume,
thickness, weight, and manufacturing costs of packaging while doubling the
pin count, the process also has significant positive effects on the thermal
conductivity and speed of the components.
Microsystems with these properties form the basis for quick digitization in
many different areas of our lives. The number of chips installed in
smartphones, for instance, has increased more than tenfold in the past 10
years. The megatrends of electro mobility and autonomous driving, in
addition to the driver assistance systems already installed in vehicles
today, will cause major leaps in installed chips in the automotive industry.
The global electronics industry association SEMI expects to see an increase
from currently between 60 and 100 sensors per car to over 200 sensors in
2020.
Eckhard Hörner-Marass, CEO of Manz AG, comments: "By entering the market for
fan-out panel level packaging, we are securing our access as a high-tech
equipment manufacturer to an absolutely future-oriented field in
microelectronics. Due to cost and productivity benefits, we are seeing a
trend in the semiconductor market towards producing rectangular panel
formats using the FOPLP process technology. As a specialist in printed
circuit board and display production, we have the technological expertise
necessary to establish ourselves as the world's first provider of a fully
integrated and automated FOPLP production solution in cooperation with our
strategic partners. Furthermore this project shows the importance of the
merger of our previously independent business units Display and PCB early
this year, since a close interlocking of the respective competencies is key
to success for the FOPLP process."
Robert Lin, Vice President of the Display and PCB segment and General
Manager of Manz Taiwan Ltd., adds: "With over 7,500 installed systems and
roughly 30 years of experience, Manz is a market leader in Taiwan and China
in the area of wet-chemical processes for producing printed circuit boards
as well as displays and touch panels of different substrate sizes. Process
technology developed for these target groups is now being used in the FOPLP
process. We are glad to start working together with our cooperation
partners, and will make our contribution to initiate mass production of
FOPLP as a pioneer in this growth market."
Company profile:
Manz AG - passion for efficiency
As a globally leading high-tech equipment manufacturer, Manz AG, based in
Reutlingen, Germany, is a pioneer of innovative products in fast-growing
markets. Founded in 1987, the company has expertise in five technology
sectors: automation, laser processing, and measurement technology, as well
as wet chemical and roll-to-roll processes. These technologies are deployed
and continuously developed by Manz in three strategic business segments:
"Electronics," "Solar," and "Energy Storage."
The company has been listed on the stock exchange in Germany since 2006 and
currently develops and manufactures in Germany, China, Taiwan, Slovakia,
Hungary, and Italy. It also has sales and service branches in the USA and
India. Manz AG currently has around 1,700 employees, about half of which are
located in Asia. With its claim "passion for efficiency," Manz makes the
following service promise to its customers active in dynamic future-oriented
industries: offering production equipment with the highest degree of
efficiency and innovation. With Manz AG's comprehensive expertise in the
development of new production technologies along with the equipment required
for this, the company makes a significant contribution to reducing the
production costs for end products and making these accessible to a broad
range of buyers around the world.
Investor Relations Contact
cometis AG
Claudius Krause
Phone: +49 (0)611 - 205855-28
Fax: +49 (0)611 - 205855-66
E-mail: [email protected]
Manz AG
Axel Bartmann
Phone: +49 (0)7121 - 9000-395
Fax: +49 (0)7121 - 9000-99
E-mail: [email protected]
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28.06.2018 Dissemination of a Corporate News, transmitted by DGAP - a
service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
The DGAP Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
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Language: English
Company: Manz AG
Steigäckerstr. 5
72768 Reutlingen
Germany
Phone: +49 (0) 7121 9000-0
Fax: +49 (0) 7121 9000-99
E-mail: [email protected]
Internet: http://www.manz.com
ISIN: DE000A0JQ5U3
WKN: A0JQ5U
Listed: Regulated Market in Frankfurt (Prime Standard); Regulated
Unofficial Market in Berlin, Dusseldorf, Munich,
Stuttgart, Tradegate Exchange
End of News DGAP News Service
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