13.03.2017
SÜSS MicroTec AG DE000A1K0235
DGAP-News: SUSS MicroTec Launches XBS200 - A New Automated Permanent Wafer Bonding System
DGAP-News: SÜSS MicroTec AG / Key word(s): Product Launch
SUSS MicroTec Launches XBS200 - A New Automated Permanent Wafer Bonding
System
13.03.2017 / 13:30
The issuer is solely responsible for the content of this announcement.
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SUSS MicroTec Launches XBS200 - A New Automated Permanent Wafer Bonding
System
Garching, March 13, 2017 - SUSS MicroTec, a leading supplier of equipment
and process solutions for the semiconductor industry and related markets,
launched a brand-new automated permanent wafer bonding system today. The
XBS200 is a universal platform, designed for aligned wafer bonding of wafer
sizes up to 200 mm.
Its versatility and modular design offer maximum process flexibility in all
permanent bonding tasks. A novel aligned wafer transfer method eliminates
the complexity of traditional systems and offers consistent process results
with excellent system availability. The XBS200 platform provides low cost of
ownership for high-volume production of MEMS, LED and 3D stacked devices.
Its new bond aligner uses SUSS MicroTec's proprietary Inter-Substrate
Alignment (ISA) technology and delivers consistent submicron alignment.
Automated calibration and overlay verification ensures optimum
repeatability.
The bond chamber is based on the very successful stand-alone XB8 bonder. It
offers a wide parameter window with temperatures of up to 550 C and bond
forces of up to 100kN. Its innovative mechanical and thermal chamber design
results in optimal bonding force and temperature distribution across the
wafer and therefore ensures high yield.
"With the development of the new XBS200 platform, SUSS MicroTec enters the
attractive market for automated permanent bonding systems. The XBS200 is
based on our successful temporary bonding equipment platform and was
designed according to the needs and demands of our customers", says Stefan
Lutter, General Manager of the bonder product line. "The XBS200 offers high
throughput along with a small footprint, high alignment accuracy and
repeatability as well as excellent temperature and bond force uniformity for
maximum yield."
For more information visit: www.suss.com
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for
microstructuring in the semiconductor industry and related markets. In close
cooperation with research institutes and industry partners SUSS MicroTec
contributes to the advancement of next-generation technologies such as 3D
Integration and nanoimprint lithography as well as key processes for MEMS
and LED manufacturing. With a global infrastructure for applications and
service SUSS MicroTec supports more than 8.000 installed systems worldwide.
SUSS MicroTec is headquartered in Garching near Munich, Germany. For more
information, please visit http://www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Senior Manager Investor Relations
Schleissheimer Strasse 90
85748 Garching, Deutschland
[email protected]
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: [email protected]
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13.03.2017 Dissemination of a Corporate News, transmitted by DGAP - a
service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
The DGAP Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Archive at www.dgap.de
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Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: [email protected]
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Listed: Regulated Market in Frankfurt (Prime Standard); Regulated
Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover,
Munich, Stuttgart, Tradegate Exchange
End of News DGAP News Service
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553297 13.03.2017
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